In the world of mobile gaming, REDMAGIC is one of the few remaining brands dedicated to this particular corner of the smartphone and tablet market, and it is about to unleash another new device on users with the REDMAGIC 12 Pro Plus, a device that will apparently introduce some very remarkable upgrades compared to the last models, and it is coming quite soon.
REDMAGIC has confirmed the official announcement date of the upcoming phone, which is scheduled for next month. The gaming phone brand plans to fully unveil the phone itself, along with all the usual details like specs, features and price point. It should also reveal the availability, although this is all expected in line with the Chinese release of the phone.
REDMAGIC always keeps separate announcements and launch dates for its devices with regards to a Chinese release, and a global release which includes the United States.
The REDMAGIC 12 Pro Plus will be announced on October 15
While REDMAGIC has not officially reached out and confirmed specific details, it has posted on its official social media channels that a Chinese announcement event will take place on October 15 at 2:30pm local time in China.
A teaser image of the phone reveals that REDMAGIC will continue to use the liquid cooling hardware on this new phone. It debuted this feature for the REDMAGIC 11 Pro, and has since used it in other devices.
A second teaser image offers slimmer bezels. Not just any slimmer bezel, but the slimmest bezel of any REDMAGIC device. According to the brand, the REDMAGIC 12 Pro Plus will have bezels that are 0.96mm thin. This is compared to 1.25mm on the REDMAGIC 11 Pro. The phone is also said to be powered by Qualcomm’s Snapdragon 8 Elite Extreme Gen 6 chipset.