Samsung may be ready to do something it has never done with its ultimate flagship. While rumors about processor choices usually stay in boardrooms, a secret new prototype equipped with a slightly larger vapor chamber shows that an Exynos 2700-powered Galaxy S27 Ultra is finally possible.
A fresh leak from tech tipster Kro shows that engineers are actively building test units designed with updated thermal hardware, specifically tuned to see if internal silicon can handle the heat.
Redesign of thermals for internal silicon
Changing the internal cooling setup on a flagship prototype is a massive undertaking. Historically, the Ultra series has served as an untouchable sanctuary for Qualcomm’s Snapdragon processors worldwide. So, changing the internal chassis of the phone indicates serious practical tests with the 2nm Exynos 2700.
The new prototype has a slightly larger steam chamber. This is a key design change to keep surface temperatures comfortable and prevent performance throttling during intense gaming sessions or heavy 8K video recording. Extra thermal capacity gives the internal silicon room to breathe, which is essential if Samsung savvy users want to trust an Exynos chip on its top-of-the-line device.
An internal tug-of-war behind closed doors
This hardware development comes amid an ongoing debate between internal Samsung divisions. The System LSI group, which designs the Exynos chip, is making a hard push for the mobile division (MX) to adopt the Exynos 2700 worldwide across the entire S27 lineup. On the other hand, smartphone executives remain cautious, evaluating long-term thermal efficiency, yield and production costs before locking into a final supplier decision.
Adding weight to the Exynos argument are early internal benchmark leaks. The Exynos 2700 reportedly scored over 14,000 in Geekbench 6 multi-core tests – about a 9.5% lead over Qualcomm’s Snapdragon 8 Elite Extreme Gen 6. While lab benchmarks don’t always reflect real-world stability, the tipster noted that for the first time an Exynos model is being put into Ultrachip.